LaserVision Compact Twin

AOI-System LaserVision Compact TWIN

Inspection of double-sided PCBs

The LaserVision Compact Twin is based on the approved LaserVision Compact. By the integration of a second camera head the system is able to check double-sided PCBs and THT soldering points simultaneously from above and below during the running production process.

The LaserVision Twin comes with two image processing computers. They provide for a real parallel processing of the generated test data which are automatically brought together to optimize the repair handling.

Furthermore the high test speed is based on an intelligent control and the coordination of the two sensor modules at the admission and exposure moment.

Equipment

  • each two colour sensor modules above and below
  • telecentric lens
  • automatic drawer
  • flexible adapter for PCBs
  • lighting unit consisting of individually programmable modules above and below
  • optionally with side view funtion

Features

  • High efficiency and examination depth down to 01005/0.3 mm pitch even for small series and a wide product range
  • Fast and comfortable test program generation
  • Low pseudo fault rate due to flexible illumination and telecentric lens
  • Reduced serial debugging effort due to optimized component recognition
  • Uniform software with free software updates
  • User-oriented illumination profiles for various test criteria
  • Lateral cameras optional
  • Open interface for external QS systems / MES
  • Offline-programming, offline debug with original test images

Application Areas

  • Examination for presence and polarity of THT and SMD components
  • Examination of packing angles from 0-360°
  • Exact component position (offset, angle)
  • Solder joint examination on all components (SMD and THT)
  • Short-circuit test (solder bridges)
  • Co-planarity and components height measurement via laser (optional)
  • Component character verification
  • Display test (dot matrix, Multi-Segment, LCD, LED)
  • Barcode reading via camera
  • Setup verification / initial sample testing
  • Solder paste inspection